Job Description, Responsibilities & Requirements
About the Position
Engineer - DOCTECH HK LIMITED｜Meet.jobs
We are seeking an Engineer to support research and development project execution and technical development at DOCTECH HK LIMITED.
Salary
18k+ HKD Monthly
Job Description
Role Overview
We are hiring an Engineer to support research and development project execution and technical development. The Engineer will carry out hands-on experimental work, support data analysis and documentation, and execute research and development project work, contributing to meeting deliverables on schedule and achieving project milestones.
Responsibilities
- Execute research and development experiments related to electroplating, surface treatment, and semiconductor materials
- Support process development activities, including parameter optimization, repeatability improvement, and troubleshooting
- Prepare samples and assist with materials characterization and basic data interpretation
- Maintain clear experiment records, organize data, and support preparation of technical reports and documentation
- Coordinate with team members to ensure tasks and deliverables are completed on time
- Support laboratory operation, including materials preparation, equipment readiness, and compliance with safety procedures
- Perform other research and development duties as assigned to support project objectives
Requirements
- Education level: Fresh PhD degree, or Master’s degree with more than 2 years of related experience
- Hands-on laboratory experience and strong execution discipline
- Ability to follow experimental plans, maintain detailed records, and report results clearly
- Strong problem-solving mindset and willingness to learn in a fast-paced research environment
- Good communication skills and ability to work effectively with cross-functional teams
- Experience in electroplating, electrochemistry, surface engineering, or semiconductor materials
- Familiarity with advanced packaging and interconnect topics (for example, copper electroplating, copper-to-copper bonding, redistribution layer, through-glass via, through-silicon via, copper foils)
- Experience with structured experiment planning and data-driven optimization
About the Company
DOCTECH HK LIMITED is a company developing on the different hybrid copper material, especially for the applications of the future three-dimensional integrated circuit (3DIC) packaging.