Job Description, Responsibilities & Requirements
About the Position
Research Fellow - DOCTECH HK LIMITED
We are looking for a Research Fellow who excels at application process development, analysis, and additives optimization. This is a senior technical role responsible for translating electroplating chemistry and materials research into stable, repeatable, and manufacturable processes for advanced packaging and functional materials. The ideal candidate is strong in process window development, data-driven optimization, and execution across research, academic, and industry environments.
Responsibilities
- Lead research and development and optimization on electroplating additives adjustment, including bath tuning strategies, performance stabilization, and repeatability improvement
- Own application process development and analysis for semiconductor and functional materials, including process mapping, structured optimization, capability studies, and root-cause troubleshooting
- Support technology development programs related to copper-to-copper bonding applications
- Design and execute experiments, analyze results, and deliver clear technical documentation (technical reports, process guidelines, internal standard operating procedures, and internal knowledge base)
- Lead experimental design, coordinate laboratory work, and contribute to innovation of processes and products to meet project milestones and timelines
- Provide technical leadership to junior researchers and engineers; coordinate execution across projects and ensure consistent experimental standards
- Collaborate with cross-functional teams (research and development, engineering, operations) and external partners to drive industrial readiness and customer validation
- Participate in technical exchanges and roadmap discussions to align technology development with market needs
Requirements
- Master’s degree or Doctor of Philosophy degree in Chemical Engineering, Chemistry, Materials Science, or related discipline
- More than 3 years of relevant research and development experience in semiconductor and/or functional materials application processes and analysis across research, academia, and industry environments
- Strong capability in additives optimization and adjustment and translating chemistry changes into measurable process performance improvements
- Hands-on experience with process development workflows: experimental design, parameter optimization, repeatability studies, and failure analysis
- Proven ability to lead research and development activities, coordinate teams, and deliver results under timelines
- Strong technical writing and communication skills (reports, documentation, stakeholder-ready summaries)
- Experience working across research institutes, industry, and academic environments, with strong adaptability and execution discipline
- Familiarity with advanced packaging and interconnect topics such as fine-pitch copper electroplating, bonding interfaces, through-glass via or through-silicon via, copper foils, or reliability-driven development
- Demonstrated track record of mentoring teams and driving cross-functional collaboration
We Offer
- Competitive Salary: 18k+ HKD Monthly
- Full-Time Employment
- Opportunity to work with cutting-edge technology in advanced packaging and functional materials
About the Company
DOCTECH HK LIMITED
We are Doctech HK Ltd, developing on the different hybrid copper material, especially for the applications of the future three-dimensional integrated circuit (3DIC) packaging.