Semiconductor Assembly Process Development Engineer

About the Position

Renesas JP is actively driving technological innovation in semiconductor back-end processes, with a strong focus on next-generation packaging technologies such as Flip Chip and System-in-Package (SiP). We are seeking a Semiconductor Assembly Process Development Engineer to join our team in Yonezawa, Yamagata, Japan. This role offers the opportunity to work at the forefront of innovation-developing high-density, high-heat-dissipation packages for AI/HPC, as well as high-reliability solutions for automotive and IoT applications-and to contribute to technologies that underpin transformative advancements such as AI and autonomous driving.

Responsibilities

• Development and evaluation of advanced packaging technologies, including FCCSP and FCBGA
• Material and process development, as well as improvement of assembly processes (e.g., molding, strip grinding, ball mounting, marking, and package sawing)
• Support for production line setup and transition to mass production
• Driving process quality improvements and yield enhancement activities

Requirements

[MUST]

• Minimum of 5 years of experience in technology development for semiconductor back-end processes (assembly and packaging)
• At least 5 years of experience in technology development in one or more of the following processes: Molding, Strip Grinding, or Package Sawing
• Hands-on experience in process improvement, quality control, and equipment introduction/implementation
• Bachelor’s degree or above in a technical field such as Mechanical Engineering, Materials Science, Electronics, Chemistry, or a related discipline

[Language]

• Japanese: Business-level proficiency required, with the ability to participate in meetings, engage in technical discussions, and communicate effectively with internal and external stakeholders
• English: Approximately TOEIC 700 level, with the ability to communicate effectively in a business environment, particularly in reading and writing

[WANT]

• Experience in developing packages for AI / HPC applications, particularly with a focus on high-reliability design
• Experience in the development of advanced packaging technologies such as FCBGA, FCCSP, or FCLGA
• Experience working with and meeting quality standards such as ISO or IATF

We Offer

• Competitive salary
• Opportunity to work in a dynamic and innovative environment
• Career growth and development opportunities

About the Company

Renesas JP, under the purpose of "To Make Our Lives Easier" (人々の暮らしを楽“ラク”にする), provides embedded semiconductor solutions. As a leader in embedded semiconductors with high quality and system-level know-how, we offer scalable and comprehensive solutions for automotive, industrial, infrastructure, and IoT sectors, focusing on high-performance computing, embedded processing, analog & connectivity, and power. With over 22,000 diverse employees in more than 30 countries, we challenge limits and open a new era of innovation through digitalization, enhancing user experience and working towards sustainable and energy-efficient solutions for the future of people and communities worldwide.