Sr Staff Package Design Engineer

About the Position

Synopsys software engineers are key enablers in the world of Electronic Design Automation (EDA), developing and maintaining software used in chip design, verification, and manufacturing. They work on assignments like designing, developing, and troubleshooting software, leveraging the state-of-the-art technologies like AI/ML, GenAI, and Cloud. Their critical contributions enable worldwide EDA designers to extend the frontiers of semiconductors and chip development.

Responsibilities

• Lead four to six test-chip package designs per year from requirements definition through final delivery, coordinating across internal teams, customers, and external partners.
• Define package requirements early in the design cycle, including bump maps, ball maps, and layer stack-up decisions that optimize signal integrity and power integrity performance.
• Perform hands-on physical design and layout of advanced package substrates using industry-standard EDA tools.
• Extract electrical models from substrate designs using 3D EM simulation tools like Ansys HFSS, and analyze them against SI and PI requirements to validate performance.
• Guide customers through package architecture evaluations and tradeoff analysis to identify implementation options that work for Synopsys IP.
• Resolve complex package design and integration issues by developing technically sound solutions that balance electrical performance, manufacturability, and cost.
• Provide regular project updates to management covering progress, technical risks, dependencies, mitigation plans, and decisions that need escalation.

Requirements

• 10+ years of hands-on experience in semiconductor package design, package substrate layout, electrical modeling, or closely related work.
• Advanced knowledge of circuit theory and transmission line behavior, with the ability to apply it to high-speed package interconnect design and analysis.
• Demonstrated experience building, validating, and interpreting 3D electromagnetic models using Ansys HFSS or comparable simulation tools.
• Strong written and verbal communication skills in English, with the ability to explain complex technical tradeoffs to customers, partners, and cross-functional teams.
• Working knowledge of Windows and Linux environments used for engineering design and analysis workflows.
• Bachelor's degree in electrical engineering, electronics engineering, or equivalent field.

Nice to Have

• Experience with advanced packaging technologies such as 2.5D interposers, fan-out wafer-level packaging, or chiplet integration.

We Offer

• Competitive salary range: $119,000 - $178,000 per year.
• Comprehensive range of health, wellness, and financial benefits.
• Opportunity to work with a highly skilled and supportive global team.
• Professional development and career growth opportunities.

About the Company

Synopsys is the leader in engineering solutions from silicon to systems, enabling customers to rapidly innovate AI-powered products. We deliver industry-leading silicon design, IP, simulation and analysis solutions, and design services. We partner closely with our customers across a wide range of industries to maximize their R&D capability and productivity, powering innovation today that ignites the ingenuity of tomorrow.

Application Process

1. Apply: Submit your resume, skills, and experience for consideration.
2. Phone Screen: A recruiter and/or hiring manager will reach out to learn more about you and share more about the role.
3. Interview: You will be invited to meet with the hiring team to measure your qualifications for the role.
4. Offer: If selected, your recruiter will make you a verbal offer, followed by a written offer.
5. Onboarding: Complete necessary steps before your first day, including new hire documentation.
6. Welcome: Get acclimated with the help of your manager, team, and a peer buddy.

Location

• City: Nepean
• Country: Canada
• Remote Eligible: No

Contact

For any accommodation requests, please contact [email protected].