【Takasaki/Toyosu】Principle Package Engineer

About the Position

【Takasaki/Toyosu】Principle Package Engineer

We are seeking a Principle Package Engineer for new Power MOSFET products in Takasaki, Japan, focusing on package development and thermal analysis.

Responsibilities

Package Development & NPI Support

• Support package development activities for new Power MOSFET products including:
  • TOLL / TOLG / TOLT
  • Bottom-side cooled (BSC)
  • Dual-side cooled (DSC)
  • Top-side cooled (TSC)
  • Advanced lead frame and clip-bond packages
• Define package requirements and specifications for new product development.
• Support package qualification and AEC-Q101 compliance activities.
• Drive package-related activities during NPI and product transition.

Thermal & Mechanical Engineering

• Perform thermal analysis and package characterization.
• Conduct thermal resistance and thermal impedance measurements.
• Evaluate package reliability associated with:
  • Power cycling
  • Thermal cycling
  • Solder joint reliability
  • Mechanical stress
• Support package-level failure analysis and root cause investigation.

Package Benchmarking & Technology Survey

• Benchmark competitor power package technologies.
• Analyze package construction, materials, and performance.
• Identify technology trends and recommend future package roadmaps.
• Conduct package reverse engineering and technical assessments.

Simulation & Modeling

• Develop and maintain thermal simulation models.
• Support electrical and mechanical package simulations.
• Correlate simulation results with measurement data.
• Collaborate with system engineers on thermal optimization and system-level performance evaluation.

Product & Customer Support

• Support customer inquiries regarding:
  • Thermal performance
  • Package selection
  • Reliability considerations
• Work with Application Engineering teams on customer design support.
• Develop package-related technical documentation and application notes.

Cross-Functional Collaboration

• Coordinate package activities with:
  • Design Engineering
  • Product Engineering
  • Reliability Engineering
  • Manufacturing
  • Marketing
  • External package suppliers
• Participate in product definition reviews and technical decision-making.

Requirements

Must Have

• Thermal characterization and analysis
• Semiconductor package design fundamentals
• Reliability testing and qualification
• Failure analysis techniques
• Statistical data analysis
• PCB and thermal design knowledge

Nice to Have

• Thermal simulation tools:
  • ANSYS Icepak
  • ANSYS Mechanical
  • FloTHERM
• Familiarity with:
  • Automotive semiconductor requirements
  • AEC-Q101
  • APQP/PPAP

We Offer

• Career Development: Opportunities to start and advance your career in various departments and product groups.
• Impactful Work: Contribute to the development of innovative products and solutions that enhance user experience and improve people's lives.
• Inclusive Environment: A supportive and inclusive workplace with flexible working arrangements, including hybrid work models and remote work options.

About the Company

ルネサスは、「To Make Our Lives Easier」（人々の暮らしを楽“ラク”にする）というPurposeの下、組み込み半導体ソリューションを提供します。高品質とシステムレベルノウハウを兼ね備えた組み込み半導体のリーダーとして、自動車、産業、インフラ・IoT分野向けに、ハイパフォーマンスコンピューティング、組み込みプロセッシング、アナログ＆コネクティビティ、そしてパワーを含めた幅広い製品ポートフォリオを軸とした、スケーラブルで包括的なソリューションを提供しています。

ルネサスは、30か国以上で22,000 人を超える多様性あふれる従業員と共に、限界に挑戦しながら、デジタライゼーションを通じてユーザエクスペリエンスを充実化させ、新たなイノベーションの時代を切り開いていきます。そして世界中の人々やコミュニティの未来のために、持続可能で省エネ効果の高いソリューションの開発に全力で取り組み、「To Make Our Lives Easier」を実現します。