Process Engineer

About the Position

Renesas is actively promoting technological innovation in semiconductor back-end processes, focusing on next-generation packaging technologies (Flip Chip, SiP, etc.).

In particular, in the fields of AI, high-performance computing (HPC), automotive, and IoT, there is a demand for packaging technologies with higher density, reliability, and heat dissipation. The development of FCCSP (Flip Chip Chip Scale Package) and FCBGA is accelerating.

As device complexity and multifunctionality increase, expanding the technological domain and strengthening the development system are essential.

Considering this situation, we are recruiting engineers with technical experience in semiconductor back-end processes.

In this position, you will be involved in cutting-edge technology development, such as high-density and high-heat dissipation packages for AI/HPC and high-reliability packages for automotive and IoT.

It is a highly rewarding environment where you can contribute to the development of packaging technologies that support the core of transformative technologies like AI and autonomous driving.

Responsibilities

• Development and evaluation of advanced packaging technologies such as FCCSP and FCBGA
• Material and process development, improvement of assembly processes (Molding, Strip Grinding, Ball mount, Mark, PKG saw)
• Support for manufacturing line setup and mass production transition
• Quality and yield improvement activities in the process

*The scope of work location changes and the scope of duties to be performed will be detailed during the selection process.

Requirements

• MUST

  • 5+ years of experience in semiconductor back-end process technology development (assembly, packaging)
  • 5+ years of experience in technical development for Molding/Strip Grinding/PKG saw processes
  • Practical experience in process improvement, quality management, and equipment introduction
  • Technical degree (mechanical, materials, electronics, chemistry, etc.)

• WANT

  • Experience in developing AI/HPC packages (high-reliability design)
  • Experience in developing FCBGA/FCCSP/FCLGA packages
  • Experience in complying with quality standards (ISO/IATF)

We Offer

Renesas offers competitive compensation and comprehensive benefits. Details of the benefits will be provided during the selection process.

About the Company

Renesas, "To Make Our Lives More Convenient and Fun," is committed to creating a better future. We invite you to join us in this challenge. We look forward to your application.

If you are interested in this position, please feel free to contact us at the details below:

Recruiter: Nichika Higa (linkedin.com/in/nichika-higa-30aa45240)

Video URL

Additional Information

• Department: Manufacturing
• Location: Nakatsu, Japan
• Remote: No
• Requisition ID: 20025483_2026-02-04