Staff Product Package Engineer

About the Position

We are seeking a Staff Product Package Engineer to join our team in Bayan Lepas, Malaysia, focusing on sustaining engineering activities for power IC products. This role is critical in ensuring the long-term quality, reliability, and manufacturability of our products. The ideal candidate will collaborate with cross-functional teams to support mature products in high-volume production, drive package design improvement, resolve customer issues, and extend product lifecycle.

Responsibilities

• Product owner to multiple products lifecycle.
• Oversees high volume AI Products mass production assembly line readiness, manufacturing execution across all internal factory and subcontractors.
• Monitor and resolve manufacturing issues, working closely with fabrication, assembly, and test sites.
• Sustain Product COGS improvement and process optimization such as Yield/Volume/Test Time/failure improvements. Improve Test process and prevent potential quality excursions.
• Manage and mitigate risk in MRB / PCRB (Process Change Review Board) to keep delivery by supporting product qualifications, second-source/material changes, and process migrations/improvements.
• Cross-functional interface with Operation, QA, Reliability, Factory, and OSAT.

Requirements

• Proven track record of successful Package Development execution and/or Assembly line introduction for high volume mass production manufacturing factory and subcontractors.
• At least 5 years’ experience in package development and process engineering.
• Bachelor's Degree in Engineering in Mechanical, Electrical/Electronic, Physics, Materials, or related fields.
• Experience in product ramp execution, bill of material readiness, equipment capacity planning, process optimization, and preventing potential quality excursions.
• Experienced in process engineering or package development of material/process/design.
• Experience in CuClip thin die assembly processes, SPS solder attach processes.
• Highly self-motivated, adaptable, and good time management skills.
• Proficient in data manipulation and analysis skills. Familiar with JMP, PDF Exenso is a plus.
• Must have good verbal and written communication skills in English.
• Good interpersonal, communication, and collaboration skills.

We Offer

• Competitive salary.
• Opportunity to work on world-leading technology for Automotive, Industrial, Infrastructure, and IoT.
• Collaborative spirit and mindset that drives semiconductor technology to transform industries and impact millions of lives.
• Comprehensive benefits package.

About the Company

Renesas is an embedded semiconductor solution provider driven by its Purpose, To Make Our Lives Easier. With a global team of over 21,000 engineers and problem solvers in more than 30 countries, we offer the opportunity to work on world-leading technology for Automotive, Industrial, Infrastructure, and IoT, shaping a safer, healthier, greener, and smarter future.

At Renesas, TAGIE is our culture, grounded in being Transparent, Agile, Global, Innovative, and Entrepreneurial. It shapes how we work, grow, and deliver on our purpose together. This collaborative spirit and mindset drive our semiconductor technology to transform industries and impact millions of lives.

Renesas Electronics is an equal opportunity and affirmative action employer, committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by law. For more information, please read our Diversity & Inclusion Statement.

Are you ready to join our team and shape the future with us?